Recent Research Progress of Generation Mechanism and Influence Factors of Intrinsic Stress in Vacuum Deposited Copper Films

In physical vapor deposition of copper films,copper atoms with high surface migration on substrate grows in the way of Volmer-Weber mechanism.Obvious intrinsic stress (compressive stress or tensile stress) usually exists in copper film,leading to deformation of copper film/substrate system as a whole.Intrinsic stress has adverse effect on the precise applications of copper films.Researches about intrinsic stress generation mechanisms,influence factors and so on will be reviewed in this paper.Techniques of decreasing and eliminating intrinsic stress will be discussed and proposed at the same time.