Research Progress in Preparation of Barrier Film by Plasma Technology （Ⅱ）

Over the past several decades, the moisture and gas barrier films on the flexible plastic substrates have been widely used in various fields, such as s food packaging, encapsulation of organic electronics, organic light-emitting diodes（OLED）, sealing of vacuum insulation panels, biomedical applications, and renewable organic energy. The technique of plasma has demonstrated unique characteristic and advantages to fabricate the barrier films, including the low cost and easy to scale-up. A plasma technique commonly used for prepare barrier films are plasma enhanced physical vapor deposition （PEPVD）, plasma-assisted/enhanced chemical vapor deposition （PACVD/PECVD）, and plasma-assisted/enhanced atomic layer deposition （PAALD/PEALD）. This work mainly focus on the fabrication of barrier films via plasma-based technology. The effects of the plasma source and plasma working environment on barrier films growth will be summarized, and mechanism of plasma-enhanced film growth in PVD, PECVD or PEALD will be discussed.