WANG Xiao-yan, ZHAI Xiu-jing, ZHANG Ting-an, et al. THERMAL STABILITY OF MECHANICAL PROPERTY AND THERMAL EXPAND COEFFICIENT OF SILICONE CHIP[J]. VACUUM AND CRYOGENICS, 2009, 15(3): 156-159.
Citation: WANG Xiao-yan, ZHAI Xiu-jing, ZHANG Ting-an, et al. THERMAL STABILITY OF MECHANICAL PROPERTY AND THERMAL EXPAND COEFFICIENT OF SILICONE CHIP[J]. VACUUM AND CRYOGENICS, 2009, 15(3): 156-159.

THERMAL STABILITY OF MECHANICAL PROPERTY AND THERMAL EXPAND COEFFICIENT OF SILICONE CHIP

  • In this paper,evolvement of mechanical property and thermal expand coefficient of silicone chip under different temperature were investigated in the temperature range of-100 ~100℃.The results showed that complete elastic deformation changes into elastic-plastic deformation in silicone chip with increasing temperature.The plastic deformation appears earlier under higher temperature.When the material exhibited complete elasticity,elastic modulus is increasing and tension strength is reducing with increase of temperature.When the material exhibited elastic-plastic,elastic modulus is reducing and tension strength is increasing with increase of temperature and external load that produces plasticity is also reducing.Thermal expand coefficient of silicone chip increased with increase of temperature,its increasing rate is greater at low temperatures,and becomes flat at high temperatures.
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