遆元博,卫昭夏,陈志超,等. 4~5 K铟片填充下无氧铜材料接触热阻实验研究[J]. 真空与低温,2024,30(2):166−171. DOI: 10.12446/j.issn.1006-7086.2024.02.009
引用本文: 遆元博,卫昭夏,陈志超,等. 4~5 K铟片填充下无氧铜材料接触热阻实验研究[J]. 真空与低温,2024,30(2):166−171. DOI: 10.12446/j.issn.1006-7086.2024.02.009
TI Y B,WEI Z X,CHEN Z C,et al. Experimental study on thermal contact resistance of oxygen-free copper materials under indium sheet filling at 4~5 K[J]. Vacuum and Cryogenics,2024,30(2):166−171. DOI: 10.12446/j.issn.1006-7086.2024.02.009
Citation: TI Y B,WEI Z X,CHEN Z C,et al. Experimental study on thermal contact resistance of oxygen-free copper materials under indium sheet filling at 4~5 K[J]. Vacuum and Cryogenics,2024,30(2):166−171. DOI: 10.12446/j.issn.1006-7086.2024.02.009

4~5 K铟片填充下无氧铜材料接触热阻实验研究

Experimental Study on Thermal Contact Resistance of Oxygen-free Copper Materials under Indium Sheet Filling at 4~5 K

  • 摘要: 在陆续开展的深空探测任务中,高精度光学探测设备需要长期稳定的深低温工作环境。传热界面由于传热介质的热阻而存在一定的传热温差,为确保设备的工作环境,避免探测效率下降、精度下降和噪声干扰增加等严重后果,对无氧铜和不锈钢两种深低温温区常用的固体导热材料的界面接触热阻进行了实验测试。在真空、4~5.2 K、压力为3077 N、铟片为填充物的条件下,测量了粗糙度为Ra=3.2 的无氧铜接触热阻以及粗糙度为 Ra=3.2 的不锈钢-无氧铜接触热阻。结果表明:无氧铜界面间接触热阻在10−5~10−4 m2·K/W量级,且随温度的升高和粗糙度的减小而减小;无氧铜和不锈钢间的接触热阻在10−2 m2·K/W量级。

     

    Abstract: In the successive deep space exploration missions, high-precision optical detection equipment requires a long-term stable cryogenic temperature working environment. The heat transfer interface has a certain heat transfer temperature difference due to the thermal resistance of the heat transfer medium, in order to ensure the working environment of the equipment, avoid serious consequences such as detection efficiency loss, accuracy decline and noise interference increase. The interfacial thermal contact resistance of two solid thermal conductive materials, oxygen-free copper and stainless steel, was experimentally tested at the deep cryogenic temperature zone. The contact thermal resistance of oxygen-free copper(Ra=3.2 )and stainless steel-oxygen-free copper contact thermal resistance(Ra=3.2 )were texted under the conditions of vacuum, 4~5.2 K, pressure of 3077 N and indium sheet as filler. The results show that the thermal contact resistance between oxygen-free copper interfaces is 10−5~10−4 m2· K/W magnitude, and decreases with the increase of temperature and the decrease of roughness. The contact thermal resistance between oxygen-free copper and stainless steel is in the order of 10−2 m2· K/W magnitude.

     

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