Abstract: The flexible electronic barrier film is of great significance in various applications and thus needs to possess several crucial characteristics. Specifically, it must have an extremely high water and oxygen barrier property to effectively prevent the penetration of moisture and oxygen. At the same time, it is necessary to have a high level of optical transparency to ensure clear visibility and transmission of light. Additionally, firm bonding of the film layer is indispensable to guarantee the stability and durability of the entire structure. A highly efficient barrier film was meticulously developed by leveraging an organic/inorganic layered technology. This involved depositing an inorganic SiO_xC_yH_z film layer by means of Plasma Enhanced Chemical Vapor Deposition （PECVD）, which enabled precise control of the film's composition and structure. Simultaneously, an acrylic organic film layer was evaporated by vacuum evaporation, ensuring uniform and controlled deposition. Extensive tests were conducted on the surface morphology and spectrum of the film layer to obtain detailed and accurate data. Moreover, the barrier properties of the film layer were thoroughly examined to evaluate its performance in preventing the passage of substances. The stress performance of the stacked film layer was also studied in depth. Through the careful preparation of the stacked film layer, remarkable results were achieved. The water permeability of the PET/inorganic layer/organic layer/inorganic layer structure reached an impressively low level of 0.03 g/（m²·d）, while the light transmittance was an outstanding 89.2%. The stress of the organic film layer and the inorganic film layer within the stacked structure was separately measured and analyzed. By precisely matching the thickness of the organic layer and the inorganic layer, a stress-coupled stacked barrier film was successfully fabricated, offering enhanced functionality and reliability.