罗童, 陈强. 微波ECR等离子体刻蚀AAO模板中HfO2薄膜的研究[J]. 真空与低温, 2019, 25(1): 19-23. DOI: 10.3969/j.issn.1006-7086.2019.01.004
引用本文: 罗童, 陈强. 微波ECR等离子体刻蚀AAO模板中HfO2薄膜的研究[J]. 真空与低温, 2019, 25(1): 19-23. DOI: 10.3969/j.issn.1006-7086.2019.01.004
LUO Tong, CHEN Qiang. Study on Microwave ECR Directional Etching of HfO2Films in AAO Template[J]. VACUUM AND CRYOGENICS, 2019, 25(1): 19-23. DOI: 10.3969/j.issn.1006-7086.2019.01.004
Citation: LUO Tong, CHEN Qiang. Study on Microwave ECR Directional Etching of HfO2Films in AAO Template[J]. VACUUM AND CRYOGENICS, 2019, 25(1): 19-23. DOI: 10.3969/j.issn.1006-7086.2019.01.004

微波ECR等离子体刻蚀AAO模板中HfO2薄膜的研究

Study on Microwave ECR Directional Etching of HfO2Films in AAO Template

  • 摘要: 采用微波电子回旋共振(ECR)等离子体装置,对用原子层沉积(ALD)方法在阳极氧化铝模板(AAO)上制备的HfO2薄膜进行了纳米图案化研究。用CF4、Ar和O2等离子体,对HfO2薄膜进行了反应离子束刻蚀,以移除HfO2。采用高分辨率扫描电子显微镜(SEM)、原子力显微镜(AFM)和能量色散X射线光谱显微(EDX)分析,对样品刻蚀前后的形貌、结构和化学成分进行了表征。实验表明,HfO2的刻蚀具有定向性,利于高深宽比微机械结构的加工。在其他参数固定的情况下,深宽比高达10∶1的结构中HfO2的刻蚀速率是微波功率、负脉冲偏压、CF4/Ar/O2混合比(Ar含量在0~100%)和工作气压的函数。在0.3 Pa气压、600 W微波功率、100 V偏置电压下,HfO2拥有0.36 nm/min的可控刻蚀速率,利于HfO2的精准图案化。刻蚀形貌表明,在CF4/Ar/O2等离子体刻蚀之后,刻蚀面非常光滑,具有0.17 nm的均方根线粗糙度。

     

    Abstract: Nano-structuring of HfO2 films deposited on AAO(Anodic Aluminum Oxide) template by home-made microwave electron cyclotron resonance(ECR) plasma equipment is described.The remove of HfO2 films was carried out by the reaction ion beam etching using CF4, Ar and O2 plasmas.A combination of high-resolution scanning electron microscopy, atomic force microscopy, and energy-dispersive X-ray spectroscopy microanalysis was used to characterize the before and after samples pattern morphology, structure, and chemical composition.We found that the etch of HfO2 in our experiments is directional which is favorable to the process of high aspect ratio micro mechanical structures.The etch rate of HfO2 in the high aspect ratio construction that is up to 10:1 in our operations was measured as a function of microwave power supply, negative pulsed bias power supply, CF4/Ar/O2 mixing ratio in the range of 0 to 100% Ar and working pressure at a fixed the others parameters.The experiments indicate that the optimum etch rate is 0.36nm/min in our device at gas pressure(0.3 Pa), microwave power(600 W), bias power(100 V).The etched HfO2 at the bottoms of the AAO template was found to be residue-free and automically smooth with a root mean square line roughness of 0.17 nm after CF4/Ar/O2 plasma etching.

     

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