Abstract: Thermal management of high power systems has become a great challenge due to the miniaturization and integration of microelectronic chips， lasers and high voltage devices. As an efficient heat dissipation method， flow boiling heat transfer in microchannels can achieve large heat flux cooling. However， the mechanism of flow boiling in microchannels is still not clear， and problems such as flow instability and dryout require extensive research on the optimization and enhanced heat transfer methods. Based on flow boiling enhanced heat transfer in microchannels， recent advances in structure and optimal design of two-phase microchannel heat sinks are summarized， which provides guidelines for heat transfer enhancement and development of microchannel heatsinks.