赵彦辉, 史文博, 刘忠海, 等. 沉积工艺参数对电弧离子镀薄膜沉积速率影响的研究进展[J]. 真空与低温, 2020, 26(5): 385-391. DOI: 10.3969/j.issn.1006-7086.2020.05.005
引用本文: 赵彦辉, 史文博, 刘忠海, 等. 沉积工艺参数对电弧离子镀薄膜沉积速率影响的研究进展[J]. 真空与低温, 2020, 26(5): 385-391. DOI: 10.3969/j.issn.1006-7086.2020.05.005
ZHAO Yanhui, SHI Wenbo, LIU Zhonghai, et al. Progress on Effects of Deposition Processing Parameters on Coatings Deposition Rate for Arc Ion Plating[J]. VACUUM AND CRYOGENICS, 2020, 26(5): 385-391. DOI: 10.3969/j.issn.1006-7086.2020.05.005
Citation: ZHAO Yanhui, SHI Wenbo, LIU Zhonghai, et al. Progress on Effects of Deposition Processing Parameters on Coatings Deposition Rate for Arc Ion Plating[J]. VACUUM AND CRYOGENICS, 2020, 26(5): 385-391. DOI: 10.3969/j.issn.1006-7086.2020.05.005

沉积工艺参数对电弧离子镀薄膜沉积速率影响的研究进展

Progress on Effects of Deposition Processing Parameters on Coatings Deposition Rate for Arc Ion Plating

  • 摘要: 阴极电弧离子镀技术作为工业应用最多的真空镀膜技术之一,近年来得到了长足发展。但是仍存在一些技术问题尚未完全解决,如大颗粒污染、所沉积的薄膜残余应力大、不能实现低温沉积等。另一方面,电弧离子镀的沉积效率仍有待提高,尽管与同属物理气相沉积(PVD)技术的磁控溅射相比,拥有较高的沉积速率,但对于沉积厚膜(厚度超过20 μm甚至50 μm)而言,其通常的沉积速率(一般在1~10 μm/h内)较低,仍需要较长时间。针对这一问题,总结了不同沉积工艺参数对沉积速率的影响,综述了近年来电弧离子镀技术在提高沉积速率方面的研究进展,以期对该技术的发展提供一定的技术支持。

     

    Abstract: As one of most industrial applications of vacuum coating technology,cathodic arc ion plating technology has obtained the rapid development in recent years.But there are still some technical problems which have not been fully resolved,such as large particle pollution,large residual stress for the deposition of coating,and not being realized low temperature deposition,etc.On the other hand,the deposition efficiency of arc ion plating remains to be improved,although it has much higher deposition rate than that magnetic sputtering both of which belongs to the same physical vapor deposition technology,But for large thickness of coatings(more than 20 microns or even 50 microns),its usual deposition rate(generally in the range of 1 to 10 μm/h)still need a very long time.Aimed at this problem,this present work summarizes the effects of different process parameters on deposition rate,and the recent progress in the arc ion plating technology for improving the deposition rate was summarized,in order to provide certain technological support for the development of the technology.

     

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