Abstract: This paper addresses the heat dissipation problem of high-power semiconductor devices such as IGCT at high heat flux density,the effects of three different jet orifice plates and two kinds of impact surfaces on the phase-change heat transfer performance of jet impingement are studied with R245fa as working fluid.The results show that the average convective heat transfer coefficient increases with the increase of jet velocity;The bubble generated by the phase-change has a great influence on the heat transfer performance,it is necessary to select the appropriate flow rate and optimize the structure design of the cold plate,so that the bubbles can be discharged in time while enhancing the fluid disturbance,so as to maximize the heat transfer capacity;Using a suitable size of sandblasted surface can increase the number of vaporization cores and improve heat transfer performance;The phase-change heat transfer performance of jet impingement with rectangular straight fin is much better than that of water cooling.