何嘉华, 朱建炳, 庄昌佩, 等. 大面阵探测器与斯特林制冷机热耦合结构仿真设计与实验[J]. 真空与低温, 2022, 28(2): 164-169. DOI: 10.3969/j.issn.1006-7086.2022.02.005
引用本文: 何嘉华, 朱建炳, 庄昌佩, 等. 大面阵探测器与斯特林制冷机热耦合结构仿真设计与实验[J]. 真空与低温, 2022, 28(2): 164-169. DOI: 10.3969/j.issn.1006-7086.2022.02.005
HE Jiahua, ZHU Jianbing, ZHUANG Changpei, et al. Simulation Design and Experiment of Thermal Coupling Structure of Large Surface Array Detector and Stirling Cooler[J]. VACUUM AND CRYOGENICS, 2022, 28(2): 164-169. DOI: 10.3969/j.issn.1006-7086.2022.02.005
Citation: HE Jiahua, ZHU Jianbing, ZHUANG Changpei, et al. Simulation Design and Experiment of Thermal Coupling Structure of Large Surface Array Detector and Stirling Cooler[J]. VACUUM AND CRYOGENICS, 2022, 28(2): 164-169. DOI: 10.3969/j.issn.1006-7086.2022.02.005

大面阵探测器与斯特林制冷机热耦合结构仿真设计与实验

Simulation Design and Experiment of Thermal Coupling Structure of Large Surface Array Detector and Stirling Cooler

  • 摘要: 随着空间红外探测器向大面阵和长线阵列方向发展,探测器的低温平台难以被制冷机直接冷却,传统的单点热耦合方式也无法满足低温阵列的温度均匀性要求。提出一种新型的大面阵探测器与斯特林制冷机之间的桥板式热耦合结构,利用Workbench软件对耦合结构的温度分布进行了仿真分析,并进行实验验证。结果表明:冷平台的温度均匀性达到0.2 K,优于设计要求。验证了斯特林制冷机与大面阵探测器通过桥板式耦合结构进行冷量传输的合理性与可行性,为大面阵红外探测器热耦合技术的后续发展提供了参考。

     

    Abstract: With the development of spatial infrared detectors towards large-surface array and long-line arrays,the low-temperature platform of the detector is difficult to be directly cooled by the cooler,and the traditional single-point thermal coupling mode cannot meet the temperature uniformity requirements of low-temperature arrays.For these prob-lems,a new bridge plate thermal coupling structure between large surface array detector and Stirling refrigerator is pro-posed,and the temperature distribution is simulated and analyzed by Workbench software,and verified by experiments.The results show that the temperature uniformity of the cold platform reaches 0.2 K,better than the design requirements.The rationality and feasibility of Stirling refrigerator and large array detector through bridge-plate coupling structure are proved as a reference for the subsequent development of thermal coupling technology of large array infrared detector.

     

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