张帅, 安康, 杨志亮, 等. 新型MPCVD沉积模式制备高均匀性的D100 mm金刚石薄膜[J]. 真空与低温, 2022, 28(5): 549-555. DOI: 10.3969/j.issn.1006-7086.2022.05.008
引用本文: 张帅, 安康, 杨志亮, 等. 新型MPCVD沉积模式制备高均匀性的D100 mm金刚石薄膜[J]. 真空与低温, 2022, 28(5): 549-555. DOI: 10.3969/j.issn.1006-7086.2022.05.008
ZHANG Shuai, AN Kang, YANG Zhiliang, et al. 100 mm in Diameter Diamond Films with High Uniformity Prepared by Novel Deposition Mode in MPCVD System[J]. VACUUM AND CRYOGENICS, 2022, 28(5): 549-555. DOI: 10.3969/j.issn.1006-7086.2022.05.008
Citation: ZHANG Shuai, AN Kang, YANG Zhiliang, et al. 100 mm in Diameter Diamond Films with High Uniformity Prepared by Novel Deposition Mode in MPCVD System[J]. VACUUM AND CRYOGENICS, 2022, 28(5): 549-555. DOI: 10.3969/j.issn.1006-7086.2022.05.008

新型MPCVD沉积模式制备高均匀性的D100 mm金刚石薄膜

100 mm in Diameter Diamond Films with High Uniformity Prepared by Novel Deposition Mode in MPCVD System

  • 摘要: 频率为2.45 GHz的微波等离子体化学气相沉积(MPCVD)装置能够沉积直径超过60 mm的金刚石薄膜,但由于MPCVD技术中等离子体的半球形分布特点,很难保证沉积出均匀性好的大尺寸薄膜,调整等离子体分布可以在一定程度上解决这一问题。基于数值模拟的研究发现,衬底边缘悬空产生的间隙能够形成空心阴极放电,提高边缘薄膜的沉积率,优化均匀性。检测结果表明,D100 mm金刚石薄膜上80个点的厚度方差值从4.5×10-4降低到5.0×10-5,证明薄膜的均匀性得到提高。金刚石薄膜表面热应力分布更均匀,厚度极值差从70μm降低到30μm,从而降低了薄膜在研磨抛光中产生裂纹的可能性。在较低的沉积压力下,薄膜生长的均匀性和质量均有提升,极值差只有10μm。

     

    Abstract: The 2.45 GHz microwave plasma chemical vapor deposition (MPCVD) system has been able to deposit diamond films with diameters exceeding 60 mm.Due to the semi-spherical distribution of plasma in MPCVD system,it is difficult to guarantee the uniformity of the deposited large-scale films.This problem can be solved to some extent by adjusting the plasma distribution.Based on simulation,it is found that the hollow cathode discharge can be formed by the gap generated by the substrate edge suspension,which can improve the deposition rate of the edge film and optimize the uniformity.The test results showed that the thickness variance valve of 80 points on the 100 mm diameter diamond film decrease from 4.5×10-4 to 5.0×10-5,which means that the film uniformity is improved.The thermal stress distribation on the surface of the diamond film is more uniform,and thichness extreme valve difference is reduced from 70μm to 30μm,which reduces the possibility of cracks in the film during griding and polishing.At the same time,the film growth uniformity and film quality are improved at lower deposition pressure and thickness extreme valve difference is only 10μm.

     

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