GaAs功率场效应管失效中源一漏烧毁现象的SEM/SAM研究

ASPECT OF FAILURE OF SOURCE-DRAIN BURNOUT FOR GaAs MESFET BY SEM AND SAM

  • 摘要: 采用光学显微镜、扫描电子显微镜(SEM)及扫描俄歇微探针(SAM)等表面分析技术对GaAs功率场效应管(FET)源-漏烧毁失效现象进行了分析研究。SEM分析结果表明,源-漏烧毁失效的表面形貌状况较为复杂,烧伤区域的表面形态不尽一致。有源极烧毁较为严重的情况,也有漏极烧伤较严重的情况。SAM分析结果说明,源-漏烧毁FET中烧毁处附近的外表完好的源、漏条Au薄膜下欧姆接触金属薄膜层已完全消失,烧毁源、漏条部位表面化学元素有C、O、Ti、N和Ga,其中C、O在表层几十纳米深度内均有相当高的含量。结合分析结果,讨论了源-漏烧毁的物理机理。

     

    Abstract: The characterizaion of source-drain burnout of niicrowave GaAs power MESFET has been invesigated by means of Scannin Electron Microscope(SEM) and Scanning Auger Microprobe(SAM).It is found by SEM that the surface micrograph of source-drain burnout is complex。 The surface micrograph of burnout shows difference,it is sericous in some regions, owever, it is less seri-ous in the teroh regions. The SAM results indicate that the Ohmic contact layers of source and drain completely disappear in the burnout regions. The microarea near the burnout regions it not destructed. There are elements C, O, Ti, N and Ga in the burnout region surfaces. Elements C and O distrlbutes in a certain of depth in the burnout region. Combining SEM with SAM resuls,the mecha-nism of the source-drain burnout is also discussed.

     

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