Abstract: The probability of low voltage magnetron sputtering achieved by high intensity of magnetic field has been studied. Several factors confining the upper limit of the intensity B of magnetic field parallel to target surface in rectangular planar magnetron sputtering target have been studied by theory analysis, practice design and experiment. The rectangular planar magnetron sputtering target with B of 0.09 T has been designed. The results showed that the increase of the B educed greatly the touching off and keeping discharge voltage during magnetron sputtering coating, which give other approach to low voltage magnetron sputtering.