改进型GaN材料的掺杂工艺研究

INVESTIATION TECHNIQUE Mg-DOPING OF IMPROVEMENT GaN MATERIAL

  • 摘要: 采用低压金属有机化学气相沉积法在蓝宝石(0001)衬底上生长2~5 μm厚度的P-AlxGa1-xN/GaN层(0<x≤0.4),在AlxGa1-xN层中的Al浓度为0.2<x<0.7。优化了影响P型GaN性质的生长参数:Mg流量、生长温度和Ⅴ/Ⅲ比。过量的Mg源流量、过高的生长温度、过大的Ⅴ/Ⅲ比都会降低自由空穴浓度;研究了退火温度对P型GaN空穴浓度和光致发光的影响,获得了最佳退火温度为680~750℃的范围。

     

    Abstract: Two to five micrometer thick P-AlxGa1-xN/GaN layers with 0<x≤0.4 were grown by low-pressure metal organic chemical Vapour deposition on sapphire(0001)substrates.For Al concentrations 0.2<x<0.7 in the AlxGa1-xN layers,the orthogonal-design method is employed to optimize the growth parameters of p-typed GaN,such as the Mg flux,growth temperature,and Ⅴ/Ⅲ ratio.It is found that the hole concentration is reduced by excessively high Mg flux,high growth temperature,and great Ⅴ/Ⅲ ratio.The influence of the annealing temperature on the hole concentration and photoluminescence of p-typed GaN is also studied.The optimum annealing temperature is between 680℃and 750℃.

     

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