用AFM研究Cu在Si基上沉积成核的演化过程

AFM INVESTIGATIONS OF PROCESS OF CU THIN FILMS DEPOSITED ON SILICON WAFERS

  • 摘要: 室温下,利用磁控溅射在P型Si(100)衬底上沉积了Cu膜。利用原子力显微镜(AFM)对较短沉积时间内制备的样品形貌进行了观测,研究了磁控溅射沉积Cu膜时Cu在Si衬底上沉积成核的演化过程。随着沉积的进行,Si基表面的成核密度随着时间的增加而增大;核长大增高为岛状,岛与岛相互连接构成岛的通道,最后形成连续膜。在溅射到15 s时,发现奇异现象。

     

    Abstract: The Cu thin films were deposited on P-Si(100) substrates by magnetron sputtering at room temperat-ure.The surface morphology,nucleation and growth of Cu thin films on silicon were studied by growing a series of samples with different predetermined deposited times,which was followed by observation with atomic force microsco-pe(AFM).The nucleation density of Cu grew on silicon with the increase of sputtering time.In the process of deposition,nuclei grew into islands,finally formed continuous films.When the sputtering time become to 15 s,there is a strange phenomena was observed.

     

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