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RIGIDIZATION ON COMMAND OF SPACE INFLATABLE STRUCTURES
WANG Xin-wei, REN Ni, WANG Duo-shu, ZHONG yan, FENG Li-bang, LI Fei-fei
2009, 15(3): 125-130.
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MEASURING TECHNIQUE AND PROGRESS ON THERMAL PROPERTIES OF SECONDARY REFRIGERANT AT LOW TEMPERATURE
CHANG Xin-jie, HONG Guo-tong, YANG Lu-wei, LIANG Jing-tao
2009, 15(3): 131-136.
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A REVIEW FOR SOLAR ABSORPTION REFRIGERATION SYSTEM
WAN Chao, LIU Yi-cai, ZHANG Ming-yan, XIN Tian-long
2009, 15(3): 137-142.
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NUMERICAL SIMULATION OF EVAPORATION-BOILING PHENOMENA DURING VACUUM COOLING PROCESS（1）: DEVELOPMENT OF MATHEMATICAL MODEL
LI Gai-lian, HU Chun-xia, JIN Ting-xiang
2009, 15(3): 143-148.
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EFFECT OF ELECTRON BEAM RE-MELTING ON SURFACE MOTPHOLOGY AND PROPERTIES OF SILICIDE COATING
YU Bin, HE Jun, LIU Zhi-dong, JIN Qing-chen, CHEN Wei, WANG Xiang-long
2009, 15(3): 149-152.
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TOTAL HEMISPHERICAL EMITTANCE OF THERMAL CONTROL MATERIALS MEASURING BY STEADY-STATE CALORIMETRIC METHOD
WANG Yi, YIN Wen-yan, ZHANG Jian-ke, JI Yong-fu
2009, 15(3): 153-155.
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THERMAL STABILITY OF MECHANICAL PROPERTY AND THERMAL EXPAND COEFFICIENT OF SILICONE CHIP
WANG Xiao-yan, ZHAI Xiu-jing, ZHANG Ting-an, FU Yan, ZHENG Shuang
2009, 15(3): 156-159.
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ANALYSIS OF LEAK DETECTION SYSTEM FOR CRYO-INSULATION PRESSURE VESSELS
HUANG Hong, WANG Li-hong, CHEN Lian, GE Rui-hong, SUN Dong-hua
2009, 15(3): 160-164.
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ANALYSIS ON THERMAL INSULATION PERFORMANCE AND INFLUENCE PARAMETERS OF VACUUM INSULATION PANEL
WEN Yong-gang, WANG Xian-rong, CHEN Guang-qi, CHEN Shu-ping
2009, 15(3): 165-169,184.
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RESEARCHES ON THE INTELLECTUALIZED TESTING SYSTEM OF THE SECONDARY ELECTRON EMISSION YIELD OF SPACE MATERIALS BASE ON KINGVIEW 6.52 AND PLC
CHEN Da-xin, CHANG Tian-hai, QIN Xiao-gang
2009, 15(3): 170-173,184.
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THE BREAKDOWN FIELD OF SILICON OXIDE THIN FILM DEPOSITED BY RF-REACTIVE MAGNETRON SPUTTERING ON LOW TEMPERATURE
JIN Gui, HUANG Xiao-yi, JIANG Chun-zhi
2009, 15(3): 174-177,184.
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THE RECENT PROGRESS OF DOPED SEMI-CONDUCTOR OXIDE AS MULTI-FUNCTIONAL CAMOUFLAGE MATERIAL
ZHAO Yin-zhong, XU Min, LI Lin, WANG Jie-bing, WU Chun-hua, HE Yan-chun
2009, 15(3): 178-184.
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