Abstract: The chemical vapor deposition of dia mond films on copper substrates with Ti -Al -Mo intermediate layer was studied.Scanning electron microsc opy and Raman spectroscopy were used to analyze the films.The component of composites formed in the interface of the films and substrate was examined by XRD.The effect on the adhesion due to the exis tence of Al film was further studied.It showed that the adhesion of the diamond films on the copper substrate could be greatly improved.