直流反应磁控溅射制备锐钛矿型TiO2薄膜

THE DEPOSITION OF ANATASE TiO2 THIN FILMS BY DC REACTIVE MAGNETRON SPUTTERING

  • 摘要: 采用直流反应磁控溅射的方法,在衬底温度为350℃的条件下溅射高纯钛靶,并在玻璃衬底上制备了TiO2薄膜。采用正交设计法探讨了溅射气压、溅射电流、氧氩比和溅射时间等实验条件对TiO2薄膜结构的影响。经过X射线衍射和拉曼光谱分析,制备结晶良好的锐钛矿结构TiO2薄膜的最佳实验条件为:溅射气压0.3Pa;溅射电流0.7A;氧氩比1∶3;溅射时间40min;退火温度650℃。

     

    Abstract: TiO2 thin films were grown on glass substrate by DC reactive magnetron sputtering at 350 ℃. The experiments were designed by orthogonalizing method for many factors: the sputtering pressure, the ratio between oxygen and argon, sputtering current and sputtering time. The effect of each factor on the structure of TiO2 thin films was investigated. Judging from the XRD spectra and Raman spectra, the optional process conditions under which Anatase TiO2 Thin films were deposited as fellows: the sputtering pressure is 0.3 Pa, the ratio between oxygen and argon is 1∶3, sputtering current is 0.7A, the sputtering time is 40 minutes, the annealing temperature is 650 ℃.

     

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